Solderless Breadboard, Two Columns Manufacturer,Supplier and Exporter in India
Product Code : SCL-M-11670
The 1660-point
Solderless Breadboard Assembly is a high-capacity circuit modeling platform
engineered for the complex development of analog and digital systems. Adhering
to the standard 0.1” pitch for ASTM-compliant component integration, this
instrument is designed for University-level electrical engineering and
Vocational TVET laboratories. It facilitates high-fidelity terminal connections
for integrated circuits and transistors without thermal deformation.
Technical Specifications
|
Tender Specification |
OEM Technical Detail |
|
Material Grade |
High-Insulation ABS Housing;
Nickel-Silver Alloy Contacts; Metal Baseplate |
|
Total Tie-Points |
1660 Calibrated Contact
Points |
|
Bus Strip Configuration |
4 Integrated Power
Distribution Strips |
|
Pitch Spacing |
Standard 0.1” (2.54 mm) hole
spacing |
|
Breadboard Dimensions |
6.5” L x 4.3” W |
|
Baseplate Dimensions |
8.5” L x 5.1” W |
|
Interface Terminals |
3 Color-Coded Insulated
Binding Posts |
|
Mounting |
4 Ruggedized Non-Slip Rubber
Support Feet |
Key Pedagogical Outcomes
· Screen-Printed
Alphanumeric Coordinates:
Reduces cognitive load during complex schematic translation, allowing students
to accurately "Apply" theoretical circuit laws in a physical medium.
· Point
Dual Column Matrix: Supports the
"Synthesis" of advanced multi-stage systems, such as microprocessor
peripherals and signal processing arrays, by providing a high-density
footprint.
· Integrated
Metal Baseplate with 3 Binding Posts: Facilitates the "Analysis" of multi-rail power
requirements and grounding techniques essential for industrial-standard
prototyping.
· Solderless
Mechanical Contact System:
Enables iterative "Evaluation" and non-destructive debugging of
component values and logic gates, optimizing laboratory throughput.
International Logistics & Compliance
This instrumentation
is processed for global distribution via export-grade seaworthy crating
(ISPM-15 compliant) to protect internal spring contacts from
high-salinity maritime environments. Comprehensive documentation is included per
shipment: the Manufacturer’s Authorization Form (MAF), IQ/OQ/PQ
Certification for institutional verification, and User Manuals in technical
English. The hardware features a tropicalized design,
with contact alloys tested for sustained conductivity in environments up to
45°C and 90% non-condensing humidity.
